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| ♦ PRACTICAL COMPONENTS | |
| ♦ PRENT ASIA PTE LTD | |
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| PRACTICAL COMPONENTS | |
| Practical Components’ is a leading distributor of dummy components our new PoP
stacks, Package Stackable Very-Thin Fine-Pitch BGA (PSvfBGA) - a vertical alignment of
very thin BGA packages’ - are specifically designed to integrate logic and memory
components in separate packages using a standardized architecture.
Since its introduction at the end of 2004, Amkor's award winning package stackable very
thin fine pitch BGA (PSvfBGA), (the bottom, high density package that enables PoP stacks),
has been one of the fastest growing new products in Amkor's history.
The semiconductor industry shipped approximately 67 million PoP packages in 2006 and
the estimates are that the market for PoP packages will double in 2007. Please contact us at david.koh@practicalcomponents.com.sg for more information. |
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| PRENT ASIA PTE LTD | |
 Prent was founded in 1967 with the goal of becoming the leader
of the thermoforming industry. Our commitment to continuous
improvement, design innovation, and process refinement has enabled
Prent to become a world leader as a custom supplier of precision plastic thermoforming.
Our facilities are designed specifically for processing quality custom packaging, using a high-speed, computer-integrated pressure forming process. Our manufacturing process utilizes Real Time SPC and is ISO 9001 and 14001 Certified. Prent has facilities in USA (Wisconsin and Arizona), Puerto Rico (Yauco), Malaysia (Johor), Singapore (Jurong) and China (Shanghai). Prent is truly a global manufacturer of thermoformed parts. |
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