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| ♦ HENKEL | |
| ♦ HI-TECH ELECTRONICS PTE LTD | |
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| HENKEL | |
 HENKEL Introduces Die Attach Paste for Small Die
on Copper Leadframes
Adding to its portfolio of productivity enhancing die attach materials,
Henkel has developed and has made commercially available Hysol®
QMI708™, a new die attach paste for use with copper leadframes.
Designed for today’s challenging small footprint devices, Hysol QMI708 is a high performance die attach paste that has been formulated specifically for small die on copperleadframes. The innovative material has been developed to attach die 2.5mm x 2.5mm and smaller in QFN and SOIC packages using copper finished leadframes. Hysol QMI708 offers exceptional manufacturing flexibility through its ease of use, simple set up and consistent performance. |
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| HI-TECH ELECTRONICS PTE LTD | |
| Year 2008, Hi-Tech Electronics Pte Ltd, Singapore is celebrating our 20 years of experience in optics instruments. During these years, we have spread our wings to be one of the market leader for high speed camera in the South East Asia. Our products range from entry level up to the most sophisticated models to accomodate all requirements and applications in various industries. Apart from the High Speed Camera, the equipment that becomes a “MUST” in today’s industry will be the Infra-Red Thermal Camera. This equipment not only provides us some information about temperature, it can also be used as a saftey measure. Most of the industry will be using thermal camera for checking electrical panel/gadgets to avoid high temperature which can increase the risk of fatal injuries. |
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